The Ruggedized Enhanced Design Implementation (REDI) laid out in VITA 48 describes how to implement layout techniques to better support cooling methodologies on specific board form factors. Currently, it covers enhanced forced-air cooling (using baffles and plenums), advanced conduction cooling (using larger and more efficient thermal interfaces), and liquid cooling. It also addresses the use of ESD covers on both sides of the board, a necessary feature for military two-level maintenance strategies.