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Press Releases -
2009 |
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VPX |
October 2009
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Intel® Atom™ Z530 processor features on OpenVPX 3U VPX-REDI board
Concurrent Technologies introduces a leading edge ultra low power 3U VPX-REDI single board computer (SBC), the TR A40/30x RC, designed to comply with the OpenVPX VITA 65 standard. The TR A40/30x RC utilizes the 1.6 GHz Intel® Atom™ processor Z530 and the highly integrated Intel® System Controller Hub US15W both from the Intel® embedded roadmap, ensuring long term availability. The board supports up to 2 Gbytes DDR2-533 soldered SDRAM and a wide variety of I/O interfaces, including a CANbus interface, yet maintains a typical power requirement of less than 10 Watts. The RC-Series TR A40/30x RC is a VPX REDI Type 1 Two Level Maintenance conduction-cooled board with support for Built In Test (BIT). The TR A40/30x RC SBC provides a flexible PCI Express® (PCIe) OpenVPX backplane fabric interface that can be configured for several OpenVPX slot profiles from 8 x1 PCIe ports through to 2 x4 PCIe ports. This fabric flexibility makes the board well suited for both systems with direct wiring between slots on the backplane and for systems linked by a fabric switch card. An air-cooled pin-compatible VPX version is also available for non-rugged applications and bench development. The TR A40/30x RC 3U VPX REDI Intel Atom processor SBC is well suited to low power rugged applications particularly within the defense market.
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VPX |
October 2009
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High performance, OpenVPX 3U VPX-REDI board
Concurrent Technologies introduces a leading edge high performance 3U VPX-REDI single board computer based on Intel’s latest dual-core processors. The TR 501/36x is designed to comply with the OpenVPX VITA 65 standard, and utilizes the 1.86 GHz Intel Core 2 Duo SL9400 processor and the Intel® GS45 mobile class chipset both from the Intel® embedded roadmap, ensuring long term availability. The board supports up to 8 Gbytes DDR3-1066 soldered SDRAM and a wide variety of I/O interfaces including an XMC site. The rugged conduction cooled variant, TR 501/36x RC, supports VPX REDI Type 1 Two Level Maintenance. The TR 501/36x provides a flexible PCI Express® (PCIe) OpenVPX backplane fabric interface that can be configured for several OpenVPX slot profiles from 8 x1 PCIe ports through to a 1 x8 PCIe port. This fabric flexibility makes the board well suited for both systems with direct wiring between slots on the backplane and for systems linked by a fabric switch card. An air-cooled pin-compatible VPX version is also available for non-rugged applications and bench development. The TR 501/36x 3U VPX REDI SBC is well suited to high performance rugged applications particularly within the defense, aerospace and security markets.
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October 2009
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Ultra Low power Intel® Atom™ Z530 Processor PMC/XMC module
Concurrent Technologies introduces an ultra low power processor PMC/XMC module, the XP A40/x03. The board features the 1.6 GHz Intel® Atom™ processor Z530 and the integrated Intel® System Controller Hub US15W, both chosen from the Intel® embedded roadmap to ensure long term availability of supply. Additional features include up to 2 Gbytes DDR2-533 SDRAM, 4 Gbytes of NAND Flash, graphics and a variety of I/O interfaces including a CANbus controller and dual Gigabit Ethernet ports. The board has a typical power consumption of less than 10 Watts and is available in commercial and extended temperature variants, with a rugged conduction cooled board being released in the near future. The board can be used on either a PMC/XMC carrier board, or on a host CPU board where it can be used to off-load some of the host CPU’s functions. Potential applications are wide ranging but are typically expected to be within the defense, security, aerospace and telecommunication markets.
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September 2009
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VME/VXS board, Intel® Core™ 2 Duo processor and Dual DVI-I graphics
Concurrent Technologies announces a new addition to their VME/VXS critical embedded product based on Intel’s latest dual-core processors. The VX 541/06x is a single slot 6U dual PMC/XMC VME/VXS processor board featuring the latest low power high performance dual core processor from the Intel embedded roadmap - the Intel® Core™2 Duo processor operating at 2.26 GHz or 1.86 GHz. The board supports up to 8 Gbytes soldered DDR3-1066 SDRAM. A key differentiating feature of this board is that it supports dual DVI-I graphics via the front panel and dual DVI-D graphics via the rear panel. The VXS switched serial standard - VITA 41.3 - is optionally supported to provide fast data transfer between other compatible boards in the system. Commercial and extended temperature versions are available now and a ruggedized air-cooled (to VITA 47) version will be available shortly. This combination of high performance data processing and a wealth of I/O ensure the boards are ideal for intensive low power computing applications within the defense, security, telemetry, industrial control, scientific, and aerospace markets.
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August 2009
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Commercial/Ruggedized 6U CompactPCI® SBC utilizes Intel® Core™ 2 Duo processor
Concurrent Technologies announces, as part of their critical embedded product range, the release of a new 6U CompactPCI® SBC based on Intel’s 45nm process technology. The PP 531/06x a single slot 6U CompactPCI processor board uses the latest high performance mobile dual core processor from the Intel embedded roadmap, the 2.26 GHz Intel® Core™ 2 Duo processor SP9300 or the 1.86 GHz Intel® Core™ 2 Duo processor SL9400. The board is ideal for CPU intensive processing applications whereby the processor’s dual cores can access up to 8 Gbytes of on board soldered DDR3 dual channel SDRAM at up to 16 Gbytes/s. As a single slot solution, this combination of high performance data processing, and an extensive range of I/O interfaces, plus two PMC/XMC sites ensures that the PP 531/06x is an ideal choice for processing intensive applications within a range of operational environments. Commercial and extended temperature versions are now available and ruggedized, conduction-cooled or air-cooled, versions will be available shortly. Applications for this family of boards are expected within the defense, industrial control and transportation markets.
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July 2009
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Dual channel 1000Base-SX/LX PMC Fiber Adaptor
Concurrent Technologies announces the latest addition to their range of networking PMC mezzanine cards - the CL PMC/GB4 - a two channel optical fiber adaptor supporting dual SFP connectors with board options for 1000Base-SX Multi-Mode or 1000Base-LX Single-Mode fiber interfaces. Commercial and extended temperature versions are available. The board will be particularly suitable for defence or industrial applications requiring a high level of noise immunity and higher data throughput whilst maintaining a wider separation of network nodes.
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March 2009
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Latest Intel® Xeon® processors available on new 6U CompactPCI® boards from Concurrent Technologies
Concurrent Technologies has released the PP 66x/071 family of 6U CompactPCI boards, one of the first product ranges to feature the quad core 2.13 GHz Intel® Xeon® processor L5518 or the dual core 2.0 GHz Intel® Xeon® processor L5508, both of which were released today by Intel. Based on 45nm process technology and the new Intel® microarchitecture, formerly codenamed “Nehalem”, both processors are from the Intel® embedded roadmap which offers at least seven year availability. With up to 64 Gbytes of DDR3-1066 ECC SDRAM, two 10 Gigabit Ethernet ports, and several SAS and SATA300 disk interfaces, the PP 66x/071 family has one of the highest specifications available to 6U CompactPCI users today; the boards are particularly suitable for CPU intensive processing applications within the telecommunications, defence and homeland security market sectors.
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March 2009
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VME board benefits from ultra-low power 1.6 GHz Intel Atom N270 processor
Concurrent Technologies introduces their first ultra-low power VME critical embedded single board computer based on an Intel® Atom processor with a power consumption of under 20W. The board uses the 1.6 GHz Intel® Atom™ processor N270 and the Intel® 945GSE Express chipset both from the Intel® embedded roadmap, ensuring long term availability. With 2 Gbytes DDR2-533 SDRAM this ultra-low power board also supports a variety of peripheral I/O ports, Flash drive, CompactFlash™ site and PMC/XMC modules. Commercial and extended temperature versions are now available and ruggedized, conduction-cooled or air-cooled (to VITA 47), versions will be available shortly. The VP A45/01x VME SBC is well suited to ultra-low power applications for embedded market segments such as defense and industrial automation.
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March 2009
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CompactPCI Dual PMC/XMC SBC, Intel® Core™ 2 Duo, Ruggedized Conduction Cooled
For harsh operating environments Concurrent Technologies introduces their latest single-slot CompactPCI® dual-core processor, dual PMC/XMC, single board computer. The PP 452/031-RC uses a popular mobile dual core processor from the Intel® embedded roadmap, the 1.5 GHz Intel® Core™ 2 Duo processor. This ruggedized CompactPCI SBC is ideal for low power intensive processing applications where the dual processor cores can access 4 Gbytes of soldered DDR2-400 ECC SDRAM at up to 6.4 Gbytes/s. For I/O flexibility there are 2 PMC/XMC sites supporting rear I/O, plus dual SATA150, dual Gigabit Ethernet, USB and RS232 interfaces as well as onboard or removable Flash disk storage including CompactFlash™. The board also supports PICMG® 2.16 (Ethernet fabric), PICMG 2.9 (IPMI) and PICMG 2.1 (hot swap). All boards can operate as a system controller board, a peripheral board or as a satellite board (blade). A range of commercial extended temperature versions are available. Applications for this conduction-cooled board are expected within the defense, industrial control and transportation markets.
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January 2009
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CompactPCI Dual PMC/XMC SBC, Intel® Core™ 2 Duo, Commercial and Wide Temperature Environments
Concurrent Technologies announces the release of their latest single-slot CompactPCI® dual-core processor, dual PMC/XMC, single board computer. The PP 452/03x uses a popular mobile dual core processor from the Intel® embedded roadmap, the 1.5 GHz or 1.06 GHz Intel® Core™ 2 Duo processor. The board is ideal for low power intensive processing applications where the dual processor cores can access up to 4 Gbytes of soldered DDR2-400 ECC SDRAM at up to 6.4 Gbytes/s. For I/O flexibility there are 2 PMC/XMC sites supporting both front and rear I/O, plus 2 SATA150, 1 RS232, 3 USB 2.0 and dual Gigabit Ethernet interfaces. The board also supports PICMG® 2.16 (Ethernet fabric), PICMG 2.9 (IPMI) and PICMG 2.1 (hot swap). All boards can operate as a system controller board, a peripheral board or as a satellite board (blade). Commercial and extended temperature versions are now available and ruggedized, conduction-cooled or air-cooled, versions will be available shortly. Applications for this family of boards are expected within the defense, industrial control and transportation markets.
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Archived Press Releases |
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