February
2010

Lockheed Martin STAR Supplier Award Win

Concurrent Technologies, a leading developer and manufacturer of high end embedded computer products for critical applications in the defense, communications, transportation, aerospace and industrial markets, is pleased to announce it has been presented with a STAR Supplier Award from Lockheed Martin Corporation (“Lockheed Martin”) for supplier performance excellence.

[Press Release]

January
2010

AMC Processor Module with Extended Temperature option

Concurrent Technologies announce their latest high performance Advanced Mezzanine Card (AdvancedMC®) single width, mid-height or full-height, processor module suitable for AdvancedTCA®, MicroTCA™, Scope Alliance and proprietary platforms. The AM 210/x0x features a low power dual core processor from the Intel® embedded roadmap - the Intel® Core™2 Duo processor operating at 2.26 GHz or 1.86 GHz and supports up to 8 Gbytes DDR3-1066 SDRAM. The AM 210/x0x is designed for use in a variety of applications including wireless base stations, Voice over IP, media-servers, blade-servers within the communication market as well as projects within the defense, security, and industrial markets. Commercial and extended temperature versions are now available for both processor speeds. For embedded types of applications there is an option for an onboard application flash disk (up to 8 Gbytes). The AM 210/x0x supports a variety of industry standard operating systems.

[Press Release] [Spec Sheet] [Block Diagram] [Image]

January
2010

Latest Intel® Core™ i7 processors available on new 6U CompactPCI® boards

Concurrent Technologies has released the PP 712/08x family of 6U CompactPCI® boards, one of the first embedded product ranges to feature the Intel® Core™ i7 processor family, released today by Intel®. Depending on the application requirements a choice of processors are supported: the 2.53GHz Intel® Core™ i7-610E, 2.0GHz Intel® Core™ i7-620LE and the 1.06GHz Intel® Core™ i7-620UE. Based on 32nm process technology and the new Intel® integrated memory/graphics controller architecture, these processors are from the Intel® embedded roadmap which offers at least seven year availability. With up to 8 Gbytes of DDR3-1066 ECC SDRAM, dual PMC/XMC sites, three Gigabit Ethernet ports, four SATA300 disk interfaces and dual head graphics, the PP 712/08x also offers rear I/O interfaces that are compatible with the popular PP 512/06x family providing a continuing upgrade path. In addition, the PP 712/08x can optionally support extended temperatures ranging from -40°C to +85°C. The boards are particularly suitable for CPU intensive processing applications within the telecommunications, defense and homeland security market sectors.

[Press Release] [Spec Sheet] [Block Diagram] [Image]