Specification Sheet: TP 702/38x
Intel® Core i7 Processor (32nm) 3U Single Board Computer
(click to view Ruggedized Air-Cooled or Ruggedized Conduction-Cooled)
Central Processor
- 2.53 GHz Intel® Core™ i7-610E processor,
2.0 GHz Intel® Core™ i7-620LE processor or
1.06 GHz Intel® Core™ i7-620UE processor - common processor features are:-
- 32nm process technology
- dual-core processor
- 4 Mbytes shared last level cache
- Intel® Hyper-Threading Technology
- Intel® 64 Technology (64-bit computing)
- Intel® Turbo Boost technology
- uses Ball Grid Array package
- processor to DRAM memory, bus speed:-
- 610E and 620LE - 1066MHz
- 620UE - 800MHz
- graphics engine, core clock speed:-
- 610E - 500MHz
- 620LE - 266MHz
- 620UE - 166MHz
- Intel Turbo Boost technology allows faster graphics engine speed depending on the CPU loading
- utilizes Intel® Platform Controller Hub (PCH):-
- Mobile Intel® QM57 Express chipset
DRAM
- up to 8 Gbytes DDR3-1066 ECC SDRAM:-
- up to 8 Gbytes soldered on-board
- single bit error correction
- peak bandwidth of 17 Gbytes/s
- dual channel architecture
- accessible from processor or CompactPCI® bus
Hard/Flash Drive Interfaces
- 2 x SATA150 channels accessible via J2
- 1 x SATA300 channel routed to an optional 4 Gbytes NAND Flash Drive Module
- 2 x SATA300 channels to optional Flash Drive Module:-
- one or two Flash Drives
- uses XMC connectors (see Note 1)
- compatible with the TP 402/35x SBC
- Flash drive write protect signal from backplane
Ethernet Interfaces
- 2 x channels supporting:-
- 10 Base-T, 100 Base-TX, 1000 Base-T
- implemented by an Intel® 82577 and an Intel® 82574L, via 2 x1 PCI Express® ports
- both channels accessed via J2
Graphics Interface
- optional analog graphics accessed via J2:-
- integrated chipset graphics controller
- resolutions up to 2048 x 1536 @ 16M colors
- support for OpenGL 2.0, Windows® and Linux®
Serial Interfaces
- 2 serial interfaces accessible via J2
- 1 x RS-232 interface supporting Tx and Rx
- 1 x RS-232 interface supporting Tx, Rx, RI, CTS, RTS, DSR, DTR and DCD or 1 x RS-422/RS-485 supporting Tx and Rx
- 16550 compatible UARTs
Flash EPROM
- 8 Mbytes of BIOS Flash EPROM
Firmware Support
- UEFI-compliant BIOS with legacy mode support
- comprehensive Power-On Self-Test (POST)
- LAN boot firmware included
Software Support
- support for Linux®, Windows® 7, Windows® XP, Windows® XP Embedded, Windows® Server 2003, Windows® Server 2008, QNX®, Solaris® and VxWorks®
Other Peripheral Interfaces
- PC-compatible Real Time Clock
- long duration timer and watchdog timer
- option for legacy speaker interface via J2
- 2 x USB 2.0 interfaces, both accessed via J2
- external battery supply for RTC and BIOS data
- option for 4 or 8 GPIO signals via J2
- system fan monitor; CPU temperature monitor; voltages monitor; all accessible via IPMI
CompactPCI Interface
- universal signaling support, compliant with PICMG 2.0 R3.0; 3.3V or 5V signaling levels
- 33/66 MHz; 32-bit interface accessed via J1
- PCI Express link from processor via PCIe-PCI bridge for off-board accesses:-
- DMA hardware support included
- operates as a System Slot controller (supporting up to 7 peripheral slots) or operates in a Peripheral Slot:-
- supports hot-swapping peripheral boards
- PICMG 2.1 R2.0 Hot Swap Specification
- option to disable CompactPCI interface (Satellite Mode):-
- receives power from CompactPCI bus
- board can be hot swapped
IPMI
- PICMG 2.9 R1.0 (System Management Spec.):-
- implements the IPMB0 interface
- on-board Baseboard Management Controller
- supports 8 Kbytes of non-volatile memory
Safety
- PCB (PWB) manufactured with flammability rating of 94V-0
Electrical Specification (estimated)
- estimated typical power is 35W to 40W
- +5V @ tbdA (typical 2.53 GHz with 4Gbytes DRAM)
- +3.3V @ tbdA
- +12V and -12V not required
- all voltages are tolerant to ±5%
Environmental Specification
- operating temperatures:-
- 0°C to +55°C (N-Series)
- -25°C to +70°C (E-Series: 2.0 GHz or 1.06 GHz)
- -40°C to +85°C (K-Series: 2.0 GHz or 1.06 GHz)
- storage temperature: -40°C to +85°C
- 5% to 95% Relative Humidity, non condensing (operating or storage):-
- K-Series includes humidity sealant
- ruggedized versions, see separate datasheets:-
- rear plug compatible
- conduction-cooled: TP 702/38x-RC
- air-cooled: TP 702/38x-RA
Mechanical Specification
- 3U form-factor:
3.9-inches x 6.3-inches (100mm x 160mm) - single slot
- connectors: IEC-1076-4-101 for J1-J2
- shock: 20g, 11ms, ½ sine (operating);
30g, 11ms, ½ sine (non-operating) - vibration: 5Hz-2000Hz at 2g, 0.38mm peak displacement (operating);
5Hz-2000Hz at 5g, 0.76mm peak displacement (non-operating)
I/O Compatible with the TP 402/35x
- rear I/O compatible with the popular TP 402/35x
Note 1: The XMC connectors are provided for the SATA Flash Disk Module only. The CPU heatsink for air-cooled boards can not support an XMC module. The conduction-cooled board (RC-Series) can support an optional XMC module (see TP 702/38x-RC datasheet).