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TP CR1/XMC - 3U CompactPCI XMC Carrier Board

The TP CR1/XMC 3U PMC carrier board provides a flexible solution for designers wishing to add XMC I/O functionality to a CompactPCI® 32-bit 33/66MHz system. The carrier accommodates one single width XMC module conforming to the IEEE 1386 Common Mezzanine Card standard, with front panel I/O and 64-bit rear I/O. XMC modules supporting up to x4 PCI Express® interfaces can be used. A wide range of commercial and proprietary designed XMC modules can be supported such as SAS, LAN, WAN, Graphics and Communications Controllers. The XMC site provides XMC rear I/O via the PMC Pn4 connector, where the rear I/O signals are routed to the CompactPCI J2 connector. There is an optional rear panel I/O Transition Module. Options to operate in temperatures ranging from -40°C to +85°C are available. This board is rear I/O plug compatible with the ruggedized air-cooled and conduction-cooled versions.

Features

  • 3U CompactPCI XMC Carrier supports one single size XMC module
  • XMC PCI Express interface supports:
    • x1, x2 or x4 PCI Express
  • Front panel I/O
  • 64-bit rear I/O via J2 connector:
    • conforms to PICMG 2.3 R1.0 pinouts
    • rear I/O routed as differential pairs
    • rear I/O for optional PMC Pn4 connector
  • 3.3 Volt, 5 Volt, +12 Volt and -12 Volt provided for XMC modules via CompactPCI backplane
  • Occupies one 3U CompactPCI slot:
    • 32-bit 33/66 MHz PCI bus
    • 5 Volt or 3.3 Volt signaling
  • IPMI (Intelligent Platform Management Interface):
    • PICMG 2.9 (System Management Specification)
  • Extended temperature version planned:
    • -25°C to +70°C (E-Series)
    • -40°C to +85°C (K-Series, includes humidity sealant)
  • Ruggedized air-cooled version (RA-Series):
    • -40°C to +75°C, conformally coated
  • Ruggedized conduction-cooled version (RC-Series):
    • conduction cooled to ANSI/VITA 20-2001 (R2005)
    • -40°C to +85°C, conformally coated
  • Occupies one 3U CompactPCI slot
  • A Rear Transition Module is available

View the datasheet

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