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Specification Sheet: TP 402/351-RC
- Intel® Core™ 2 Duo Processor 3U SBC, Ruggedized Conduction-Cooled

(click to view Ruggedized Air-Cooled or Commercial Air-Cooled)



RUGGEDIZED SINGLE BOARD COMPUTER

  • conduction-cooled to ANSI/VITA 30.1-2002

  • conformally coated

  • ruggedized air-cooled version also available:-

  • non-rugged version also available:-

CENTRAL PROCESSOR

  • 1.5 GHz Intel® Core™ 2 Duo processor L7400:-

    • using a mFC-BGA 478 (micro Flip-Chip Ball Grid Array) package

    • 64 Kbytes of primary (L1) on-die cache

    • 4 Mbytes of shared secondary (L2) on-die cache

    • 667 MHz Front Side Bus (FSB)

    • Intel® 64 Technology (64-bit computing support)

  • utilizes 64-bit Intel® 3100 server chipset:-

    • single chip chipset with integrated memory and I/O controllers

  • provision for ITP debug port

DRAM

  • 2 or 4 Gbytes soldered DDR2-400 registered ECC SDRAM using:-

    • single channel memory

    • single-bit error correction

    • peak bandwidth of up to 3.2 Gbytes/s

  • accessible from processor or CompactPCI® bus

HARD/FLASH DISK INTERFACES

  • 5 x Serial ATA150 interfaces:-

    • transfer rate up to 150 Mbytes/s

  • 2 x channels accessible via J2

  • 1 x channel routed to on-board 512 Mbytes Flash disk

  • 2 x channels routed to optional Flash Disk Module:-

    • one or two Flash disk drives

    • appear as one or two hard disk drives

    • uses XMC site

ETHERNET INTERFACES

  • 2 x channels supporting:-

    • 10 Base-T, 100 Base-TX, 1000 Base-T

    • implemented by Intel® 82571EB via x4 PCI Express® port

    • both channels accessed via J2

XMC INTERFACE

  • 1 x XMC site, all in a single 4HP slot:-

    • XMC (Switched Mezzanine Card) interface supported via x4 PCI Express port

    • rear panel I/O via J2

    • not available with Flash Disk Module fitted

OPTIONAL GRAPHICS INTERFACE

  • optional ruggedized PMC card mounted on ruggedized 3U CompactPCI PMC carrier:-

  • for IO PMC/722-RC:-

    • implemented by Silicon Motion SM722

    • analog and digital graphics accessed via PMC rear I/O

    • 8 Mbytes video memory

    • resolutions up to 1280 x 1024; supporting up to 16M colors

SERIAL INTERFACES

  • 2 serial interfaces accessible via J2

  • 1 x RS232 interface supporting Tx and Rx

  • 1 x RS232 interface supporting Tx, Rx, RI, CTS, RTS, DSR, DTR and DCD or 1 x RS422/485 supporting Tx and Rx

  • 16550 compatible UARTs

FLASH EPROM

  • 1 Mbyte of BIOS Flash EPROM

  • hardware write protect provided

 

OTHER PERIPHERAL INTERFACES

  • PC-compatible Real Time Clock (Year 2000 compliant)

  • long duration timer

  • watchdog timer

  • legacy speaker interface

  • 2 x USB 2.0 interfaces:-

    • both accessed via J2

  • external battery supply for RTC and BIOS data

  • 4 x GPIO signals via J2

  • on-board I2C bus used for local temperature and power supply sensors, accessible via J1

COMPACTPCI INTERFACE

  • universal signaling support, compliant with PICMG 2.0 R3.0; 3.3V or 5V signaling levels

  • 33/66 MHz; 32-bit interface accessed via J1

  • utilizing a PCI Express-PCI bridge for off-board accesses

  • operates as a System Slot controller (supporting up to 7 peripheral slots) or operates in a Peripheral Slot:-

    • supports hot-swapping peripheral boards

    • PICMG 2.1 R2.0 Hot Swap Specification

  • option to disable CompactPCI interface (Satellite Mode):-

    • receives power from CompactPCI bus

    • board can be hot swapped

FIRMWARE SUPPORT

  • Phoenix™ TrustedCore BIOS

  • Trusted Platform Module (TPM) support

  • comprehensive Power-On Self-Test (POST)

  • LAN boot firmware included

SOFTWARE SUPPORT

  • supports Linux®, Windows® XP, Windows® XP Embedded, Windows® 2000, Windows® Server 2003, QNX®, LynxOS® and VxWorks®

ELECTRICAL SPECIFICATION

  • +5V@3.1A (typical with 1Gbyte DRAM)

  • +3.3V@3.7A (typical with 1Gbyte DRAM)

  • +12V and -12V not required

  • all voltages are tolerant to ±5%

SAFETY

  • PCB (PWB) manufactured with flammability rating of 94V-0

ENVIRONMENTAL SPECIFICATION

  • ruggedized operating temperatures:-

    • -40°C to +85°C (no airflow)

  • storage temperature: -40°C to +100°C

  • 5% to 95% Relative Humidity, non condensing (operating or storage):-

    • conformally coated

  • altitude (operating):
    -1,000 to 50,000 feet (-305 to 15,240 metres)

  • non-ruggedized wide temperature versions also available:

MECHANICAL SPECIFICATION

  • 3U form-factor: 3.9 inches x 6.3 inches (100mm x 160mm)

  • single slot

  • connectors: IEC-1076-4-101 for J1-J2

  • shock:
    40g, 11ms, ˝ sine (operating)

  • sine vibration:
    5Hz-2000Hz at 5g, peak (operating)

  • random vibration:
    0.1 g2/Hz (10Hz-1KHz);
    -6dB/octave (1KHz-2KHz) (operating)

  • rear plug compatible with commercial non-ruggedized TP 402/351:-

  • rear plug compatible with ruggedized air-cooled TP 402/351-RA:-